Reinhold Dauskardt

Dauskardt and his group have worked extensively on integrating new materials into emerging technologies including thin-film structures for nanoscience and energy technologies, high-performance composite and laminates for aerospace, and on biomaterials and soft tissues in bioengineering. His group has pioneered methods for characterizing adhesion and cohesion of thin films used extensively in device technologies. His research on wound healing has concentrated on establishing a biomechanics framework to quantify the mechanical stresses and biologic responses in healing wounds and define how the mechanical environment affects scar formation. Experimental studies are complimented with a range of multiscale computational capabilities. His research includes interaction with researchers nationally and internationally in academia, industry, and clinical practice.